Advanced materials such as synthetic single crystal sapphire, transparent spinel ceramic, and silicon carbide are vital important materials for semiconductor and other industries due to their special properties.

Despite all the attractive features of these advanced materials, the high mechanical resistance of these materials makes the polishing process very challenging. Fortunately, Qual Diamond has the innovative solutions to make the process easy.

Our advanced diamond slurries are formulated with high-efficiency, tightly sized, surface engineered diamond particles, paired with state-of-art human-health and eco-friendly carriers that facilitate extraordinary surface finish with no sub-surface damage on sapphire, spinel, silicon carbide, ALON optical ceramic, gallium nitride, etc.

Our solutions offer exceptionally high removal rates compared to conventional CMP methods. It can turn 8 to 24 hours of sapphire substrate polishing time to 14-40 minutes.

Thereby, it largely reduces the processing time and steps.

The polished surface is smooth, uniform, and clean without subsurface damage.

On top of it, our solutions are much more cost-effective.

Finally, it is very easy to use and clean with little training required.