Diamond Slurry For Diamond Wire Saw

Diamond Slurries for Diamond Grinding, Wire Saws, and Cutting SiC , Sapphire, Si, Ge, GaA, and GaN wafers.

 

Advantages

• Excellent adherence and retention properties.

• High cutting speed and material removal rate.

• Great cutting surface qualities.

• Eco-friendly, anti-aggregation formulation for high reproducibility.

 

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